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Contents and Authors

Molecular Electronics, James R. Heath

Phase Change Materials, Simone Raoux

Porous pSiCOH Ultralow-k Dielectrics for Chip Interconnects Prepared by PECVD, Alfred Grill

Thin-Film Organic Electronic Devices, Howard E. Katz, Jia Huang

Immersion Lithography: Photomask and Wafer-Level Materials, Roger H. French, Hoang V. Tran

Materials for Optical Lithography Tool Application, Harry Sewell, Jan Mulkens

Nanoimprint Lithography Materials Development for Semiconductor Device Fabrication, Elizabeth A. Costner, Michael W. Lin, Wei-Lun Jen, C. Grant Willson

High-κ/Metal Gate Science and Technology, Supratik Guha, Vijay Narayanan

Strain: A Solution for Higher Carrier Mobility in Nanoscale MOSFETs, Min Chu, Yongke Sun, Umamaheswari Aghoram, Scott E. Thompson

Size-Dependent Resistivity in Nanoscale Interconnects, Daniel Josell, Sywert H. Brongersma, Zsolt Tokei

Carbon Nanotube Interconnects, Azad Naeemi, James D. Meindl

Materials for Magnetoresistive Random Access Memory, J.M. Slaughter

Chameleon Coatings: Adaptive Surfaces to Reduce Friction and Wear in Extreme Environments, C. Muratore, A.A. Voevodin

Doped Oxides for High-Temperature Luminescence and Lifetime Thermometry, M.D. Chambers, D.R. Clarke

Plasticity of Micrometer-Scale Single Crystals in Compression, Michael D. Uchic, Paul A. Shade, Dennis M. Dimiduk

Recent Progress in the Study of Inorganic Nanotubes and Fullerene-Like Structures, R. Tenne, G. Seifert

Recent Progress in Theoretical Prediction, Preparation, and Characterization of Layered Ternary Transition-Metal Carbides, Jingyang Wang, Yanchun Zhou

Shape Memory Polymer Research, Patrick T. Mather, Xiaofan Luo, Ingrid A. Rousseau

Solid-Surface Characterization by Wetting, Abraham Marmur

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ISSN: 1531-7331
ISBN: 978-0-8243-1739-3

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